RIR Power Electronics Ltd. is predicted to commence “full-fledged” commercial production of digital chips by March next 12 months, Principal Secretary within the Electronics and Information Technology Department of the Government of Odisha Vishal Dev instructed The Hindu.
In an interplay on the sidelines of the Semicon India 2025, Mr. Dev said that the opposite two tasks, that of SiCSem and 3D Glass Solutions (3DGS), are anticipated to begin production in one other two years.
Commencement of commercial production on the semiconductor maker’s Bhubaneswar plant is of immense significance to the eastern-Indian state, he stated.
RIR Power on September 1, 2025, obtained ₹32.56 crore in fiscal help for Phase 1 of their silicon carbide manufacturing plant within the state’s capital. Spanning throughout two phases, the venture is price about ₹618 crore.
About the opposite tasks, the Union Cabinet on August 12 had authorized manufacturing models in 4 states, together with Odisha, with a mixed outlay of ₹4,600 crore. SiCSem and 3D Glass are to be arrange within the coastal jap Indian state. The former is collaborating with Clas-SiC Wafer Fab Ltd. (U.Okay.) to construct the primary commercial compound fab within the nation, while the latter could be organising a vertically built-in superior packaging and embedded glass substrate unit – each in Info Valley, Bhubaneswar.
Leveraging inherent benefits
Mr. Dev, mentioning Odisha’s benefits in offering important utilities, pointed to Odisha being an influence surplus state and having sufficient water availability. “We have 11% of the country’s water resources whereas we are 3% of the country’s overall population,” he said, including, “We also have the cheapest power in the country.”
The Principal Secretary additional held that the state has a semiconductor coverage which is “by far the best policy in terms of comprehensiveness and quantum of incentives”.
Odisha’s Electronics Component Manufacturing (OECM) Policy, 2025, provisions for a 30% capital funding subsidy with no ceiling. Furthermore, the primary 5 meeting, testing, marking and packaging (ATMP) tasks together with the primary three fabs would additionally 50% subsidy. Neither of them holds any cap. Mr. Dev additionally underlined that skilling is recognised as a excessive precedence sector within the realm.
