Highlighting the numerous strides made within the semiconductor sector, Union minister Rajeev Chandrasekhar has stated that within the final two years, the federal government has obtained funding proposals of Rs 2.50 lakh crore from international chip makers.
“In the present day, funding proposals of greater than Rs 2.50 lakh crore have been obtained by the Authorities of India from international semiconductor majors.India is quick changing into a semiconductor nation. Simply two years in the past, it was not even current within the semiconductor ecosystem of the world,” the IT minister stated at ‘India Semiconductor and Packaging Ecosystem Convention’ (ISPEC) at SCL Mohali.
Semiconductor coverage attracted international consideration
Within the final 10 years, India has moved out of the league of ‘Fragile 5’ and develop into the world’s fifth largest financial system, the minister stated, noting that the semiconductor coverage introduced by Prime Minister Narendra Modi in 2022 immediately attracted international consideration.
“We’ve moved from being nearly absent within the semiconductor ecosystem and merely a supplier of expertise to the worldwide semiconductor majors, to now changing into a vacation spot receiving investments and constructing vital capability and functionality throughout the spectrum, from manufacturing to design to techniques,” he added.
On the ‘Viksit Bharat Ambassador Meet’ organised in Pune this week, the IT minister stated that India has “develop into a beacon of hope and inspiration for nations the world over when it comes to our inclusive insurance policies.”
“Within the subsequent few years, the prime minister has set a goal for India to develop into ‘Viksit Bharat’,” he stated.
Deep give attention to R&D
Chandrasekhar stated that the federal government will proceed to be centered on attracting funding in semiconductor manufacturing and packaging.
“We’ve a really deep give attention to the analysis and innovation parts of the semiconductor trade. This convention highlights our eager curiosity in making a vibrant, sturdy, and aggressive ecosystem centred round innovation, packaging innovation, semiconductor analysis, chip design, and system design innovation,” stated the minister.
The event comes across the similar time because the Union Cupboard authorized three chip fabrication vegetation, two of which will probably be constructed by Tata Group.