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Foxconn ties up with HCL grp for chip packaging

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Foxconn ties up with HCL grp for chip packaging

NEW DELHI: Taiwanese contract producer Foxconn has stated that it’s teaming up with HCL Group to begin a chip packaging and testing enterprise in India.
Based on a regulatory submitting to Taiwan’s inventory change, Foxconn Hon Hai Know-how India Mega Growth, a division of the Taiwanese big, will make investments $37.2 million for a 40% possession within the three way partnership.
The chip packaging and testing enterprise, known as OSAT in trade parlance, comes after Foxconn deserted a three way partnership with Anil Agarwal-led Vedanta in July final yr.
HCL Group had earlier introduced that it was in lively talks to ascertain an OSAT facility with the state authorities of Karnataka.
When contacted, a spokesperson for HCL stated the corporate is shifting forward with a partnership with Foxconn for Outsourced Semiconductor Meeting and Take a look at (OSAT). “HCL group has a robust engineering and manufacturing heritage and this is a chance that gives strategic adjacency to the group portfolio. That is line with authorities of India’s imaginative and prescient of ‘Make in India’ and ‘Atmanirbhar Bharat’ additionally.”
The event comes after Foxconn submitted a recent utility to ascertain a semiconductor fabrication unit in India beneath the “modified scheme for organising semiconductor amenities in India” – a authorities initiative aimed toward selling the electronics manufacturing sector, together with semiconductors.
In the meantime, Foxconn will make investments a minimum of $1 billion extra in a plant in India that may manufacture Apple merchandise, a major step in the direction of its goal of creating a hub exterior of China.

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